Issue 11, 2019

Copper surface doping to improve the structure and surface properties of manganese-rich cathode materials for sodium ion batteries

Abstract

A facile copper surface doping process is proposed to enhance the surface structural stability of manganese-rich layered oxide cathodes. Herein, the surface structure of P2-type Na0.67Mn0.6Ni0.2Co0.2O2 was stabilized via the formation of a copper-rich surface layer. This layer can reduce the dissolution of manganese in the electrolyte and inhibit side reactions at the electrode/electrolyte interface. Expanded surface lattice channels induced by copper doping contributed to the improvement of Na+ mobility. In addition, it can be deduced from scanning transmission electron microscopy (STEM) images that copper surface doping resulted in a surface transition from the P2 phase to P3 phase. Electrochemical impedance spectroscopy (EIS) measurements confirmed that both the irreversible reaction resistance and charge transfer resistance of the copper surface-doped Na0.67Mn0.6Ni0.2Co0.2O2 (Cu-MNC) were significantly reduced. More importantly, the Cu-MNC electrode delivered an initial specific capacity of 122.2 mA h gāˆ’1 with retention of up to 83.3% after 150 cycles at 0.2C. After refreshing the sodium metal anode and electrolyte, it showed a high specific capacity of 102.4 mA h gāˆ’1 with retention of 84.14% after 200 cycles. These results open up a new method to optimize manganese-rich oxide materials for SIBs.

Graphical abstract: Copper surface doping to improve the structure and surface properties of manganese-rich cathode materials for sodium ion batteries

Supplementary files

Article information

Article type
Research Article
Submitted
13 Leq 2019
Accepted
19 Way 2019
First published
21 Way 2019

Mater. Chem. Front., 2019,3, 2374-2379

Copper surface doping to improve the structure and surface properties of manganese-rich cathode materials for sodium ion batteries

T. Chen, W. Liu, Y. Zhuo, H. Hu, J. Guo, Y. Liu, J. Yan and K. Liu, Mater. Chem. Front., 2019, 3, 2374 DOI: 10.1039/C9QM00522F

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