Textile-integrated multilayer liquid metal soft circuits for multienvironment wearable electronics

Abstract

Soft devices that are rugged yet deformable are essential for wearable technologies that perform in diverse environments. For textile-based wearable electronics, creating robust mechanical and electrical interconnections between electronic components on complex, deformable surfaces like textiles remains a central challenge. In this work, we present a scheme for the creation of textile electronics through multilayer liquid metal (LM) soft circuits, including robust integration with textiles and water resistance. The fabrication method enables multilayer construction with interlayer vertical interconnect access or vias, as well as the integration of rigid electronic components, to enable advanced electrical functionality while maintaining flexibility and stretchability. We achieve robust interlayer adhesion (up to 11,000 J m-2) within the soft circuits by combining multiple soft welding processes. Furthermore, the influence of textile integration on electromechanical performance is determined, providing mechanistic guidance to enable textile-integrated LM soft circuits that stretch to 300% strain with resilience against environmental damage, including water resistance. These textile-based soft circuits enable sensing and data transfer, which we show through several examples including a distributed wearable camera system. This process is adaptable to a wide variety of circuit designs and layouts, providing a path forward for robust, textile integrated electronics.