Correction: Carbon nanotube-copper exhibiting metal-like thermal conductivity and silicon-like thermal expansion for efficient cooling of electronics

Chandramouli Subramaniam; Yuzuri Yasuda; Satoshi Takeya; Seisuke Ata; Ayumi Nishizawa; Don Futaba; Takeo Yamada; Kenji Hata

doi:10.1039/C9NR90011J

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Correction: Carbon nanotube-copper exhibiting metal-like thermal conductivity and silicon-like thermal expansion for efficient cooling of electronics

Chandramouli Subramaniam,*^a Yuzuri Yasuda,^a Satoshi Takeya,^b Seisuke Ata,^ac Ayumi Nishizawa,^a Don Futaba,^ac Takeo Yamada^ac and Kenji Hata*^ac

Author affiliations

* Corresponding authors

^a Technology Research Association for Single wall Carbon Nanotubes (TASC), Central 5, 1-1-1 Higashi, Tsukuba 305-8565, Japan
E-mail: chandramouli-subramaniam@aist.go.jp

^b Research Institute of Instrumentation Frontier (RIIF), National Institute of Advanced Industrial Science and Technology (AIST), Central 5, 1-1-1 Higashi, Tsukuba 305-8565, Japan

^c Nanotube Research Center, National Institute of Advanced Industrial Science and Technology (AIST), Central 5, 1-1-1 Higashi, Tsukuba 305-8565, Japan
E-mail: kenji-hata@aist.go.jp

Abstract

Correction for ‘Carbon nanotube-copper exhibiting metal-like thermal conductivity and silicon-like thermal expansion for efficient cooling of electronics’ by Chandramouli Subramaniam and Kenji Hata et al., Nanoscale, 2014, 6, 2669–2674.

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Carbon nanotube-copper exhibiting metal-like thermal conductivity and silicon-li…

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DOI: https://doi.org/10.1039/C9NR90011J
Article type: Correction
Submitted: 07 Jan 2019
Accepted: 07 Jan 2019
First published: 15 Jan 2019
This article is Open Access

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Nanoscale, 2019,11, 2089-2089

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Correction: Carbon nanotube-copper exhibiting metal-like thermal conductivity and silicon-like thermal expansion for efficient cooling of electronics

C. Subramaniam, Y. Yasuda, S. Takeya, S. Ata, A. Nishizawa, D. Futaba, T. Yamada and K. Hata, Nanoscale, 2019, 11, 2089 DOI: 10.1039/C9NR90011J

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Correction: Carbon nanotube-copper exhibiting metal-like thermal conductivity and silicon-like thermal expansion for efficient cooling of electronics

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