Issue 7, 2010
From the journal:

Chemical Communications

A hydrogen bonding motif for forming extended assemblies†

Jiahui Zhang,ab   Xiangxiang Wu,ab   Kazuhiro Yamato,c   Futao Liu,ab   Tianyi Su,ab   Chong Zheng,d   Lan He*ab  and  Bing Gong*abc  

* Corresponding authors

a College of Chemistry, Beijing Normal University, Beijing 100875, China

b State Key Laboratory of Applied Organic Chemistry, Lanzhou University, Lanzhou 730000, China
E-mail: helan1961@yahoo.com.cn
Tel: (+86) 10 5880 2076

c Department of Chemistry, University at Buffalo, State University of New York, Buffalo, USA
E-mail: bgong@buffalo.edu
Fax: (+1) 716 645 6963
Tel: (+1) 716 645 4307

d Department of Chemistry and Biochemistry, Northern Illinois University, DeKalb, USA
E-mail: czheng@niu.edu

Abstract

Oligoamide strands containing tertiary amide groups were found to share a basic structural motif that promotes the formation of H-bonded, chain- or tape-like supramolecular assemblies.

Graphical abstract: A hydrogen bonding motif for forming extended assemblies

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Article information

DOI
https://doi.org/10.1039/B924008J
Article type
Communication
Submitted
16 Nov 2009
Accepted
30 Nov 2009
First published
12 Jan 2010

Chem. Commun., 2010,46, 1062-1064

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A hydrogen bonding motif for forming extended assemblies

J. Zhang, X. Wu, K. Yamato, F. Liu, T. Su, C. Zheng, L. He and B. Gong, Chem. Commun., 2010, 46, 1062 DOI: 10.1039/B924008J

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