Micro structure fabrication with a simplified hot embossing method

Abstract

A facile hot embossing method—low pressure hot embossing (LPHE)—is reported in this paper. Compared with large and expensive hot embossing machines, just an oven is used for heating with a compact self-designed loading device inside to apply pressure. Due to the small loading device, only a low embossing pressure can be applied. Micro linear arrays were successfully fabricated with this method and the embossing process was systemically investigated. Orthogonal arrays were used to analyze the hot embossing behavior under a low embossing pressure. As LPHE is easy to realize at a cheap price, it is very helpful for researchers interested in fabricating micro structures such as micro fluidic chips used in prototype experiments.