Issue 48, 2015

High dielectric permittivity and low loss tangent of polystyrene incorporated with hydrophobic core–shell copper nanowires

Abstract

We reported a low-cost strategy to improve dielectric performance of polystyrene (PS) by incorporating core–shell copper nanowires (CuNWs). The hydrothermally synthesized nanowires had a fresh copper core coated with a hydrophobic insulating layer. Compared with pure PS, CuNW/PS nanocomposites exhibited drastically improved dielectric performance, as manifested by their large dielectric permittivity (ε′) and low loss tangent (tan δ). At 16 wt% CuNWs loading, dielectric permittivity of the composite reaches 37 at 1 MHz, which was about 14 times larger than that of neat PS (ε′ = 2.5), while the loss tangent of this composite was maintained at a low level (tan δ = 0.04). The pronounced dielectric improvement was ascribed to a large electrical conductivity of the fresh core of CuNWs, which provided the composites with a higher amount of mobile charge carriers participating in the interfacial polarization. The low loss tangent was attributed to the presence of insulating layer on the CuNWs, which impaired the formation of an electrically conductive network, thus suppressing dielectric loss. This simple strategy may open a new avenue to increasing dielectric permittivity of polymers while maintaining relatively low loss tangent.

Graphical abstract: High dielectric permittivity and low loss tangent of polystyrene incorporated with hydrophobic core–shell copper nanowires

Article information

Article type
Paper
Submitted
18 Mar 2015
Accepted
22 Apr 2015
First published
22 Apr 2015

RSC Adv., 2015,5, 38452-38459

Author version available

High dielectric permittivity and low loss tangent of polystyrene incorporated with hydrophobic core–shell copper nanowires

L. He and S. C. Tjong, RSC Adv., 2015, 5, 38452 DOI: 10.1039/C5RA04731E

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