Smooth and solid WS2 submicrospheres grown by a new laser fragmentation and reshaping process with enhanced tribological properties

Ting Luo; Ping Wang; Zhiwen Qiu; Shuhua Yang; Haibo Zeng; Bingqiang Cao

doi:10.1039/C6CC04212K

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Smooth and solid WS₂ submicrospheres grown by a new laser fragmentation and reshaping process with enhanced tribological properties†

Ting Luo,^a Ping Wang,^a Zhiwen Qiu,^a Shuhua Yang,^a Haibo Zeng^b and Bingqiang Cao*^a

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* Corresponding authors

^a Materials Research Center for Energy and Photoelectrochemical Conversion, School of Material Science and Engineering, University of Jinan, Jinan 250022, Shandong, China
E-mail: mse_caobq@ujn.edu.cn
Fax: +86-0531-89736292
Tel: +86-0531-89736292

^b School of Material Science and Engineering, Nanjing University of Science and Technology, Nanjing 250022, Jiangsu, China

Abstract

Smooth and solid WS₂ submicrospheres were prepared by a laser irradiation induced fragmentation and morphological reshaping process using bulk-slice WS₂ particles as targets in solution. Such submicrospheres as additives in paraffin liquid show remarkably enhanced friction reduction and anti-wear properties in comparison with raw WS₂ slices.

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Article information

DOI: https://doi.org/10.1039/C6CC04212K
Article type: Communication
Submitted: 19 May 2016
Accepted: 19 Jul 2016
First published: 19 Jul 2016

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Chem. Commun., 2016,52, 10147-10150

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Smooth and solid WS₂ submicrospheres grown by a new laser fragmentation and reshaping process with enhanced tribological properties

T. Luo, P. Wang, Z. Qiu, S. Yang, H. Zeng and B. Cao, Chem. Commun., 2016, 52, 10147 DOI: 10.1039/C6CC04212K

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Chemical Communications