Issue 5, 2016

Optimization of the nanotwin-induced zigzag surface of copper by electromigration

Abstract

By adding nanotwins to Cu, the surface electromigration (EM) slows down. The atomic mobility of the surface step-edges is retarded by the triple points where a twin meets a free surface to form a zigzag-type surface. We observed that EM can alter the zigzag surface structure to optimize the reduction of EM, according to Le Chatelier's principle. Statistically, the optimal alternation is to change an arbitrary (111)/(hkl) zigzag pair to a pair having a very low index (hkl) plane, especially the (200) plane. Using in situ ultrahigh vacuum and high-resolution transmission electron microscopy, we examined the effects of different zigzag surfaces on the rate of EM. The calculated rate of surface EM can be decreased by a factor of ten.

Graphical abstract: Optimization of the nanotwin-induced zigzag surface of copper by electromigration

Supplementary files

Article information

Article type
Communication
Submitted
11 Aug 2015
Accepted
08 Jan 2016
First published
08 Jan 2016

Nanoscale, 2016,8, 2584-2588

Author version available

Optimization of the nanotwin-induced zigzag surface of copper by electromigration

H. Chen, C. Huang, C. Wang, W. Wu, C. Liao, L. Chen and K. Tu, Nanoscale, 2016, 8, 2584 DOI: 10.1039/C5NR05418D

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