Issue 15, 2016

Low temperature sintering process of copper fine particles under nitrogen gas flow with Cu2+-alkanolamine metallacycle compounds for electrically conductive layer formation

Abstract

A novel low cost sintering process of copper fine particles to a copper conductive layer was demonstrated at as low as 100 °C without reductive gas flow. Sintering of a mixture of copper particles and copper-based metal–organic-decomposition (MOD) ink gave a copper film with high packing density and low resistivity (9 × 10−6 Ω m). This novel process may open a new strategy in the field of printed electronics.

Graphical abstract: Low temperature sintering process of copper fine particles under nitrogen gas flow with Cu2+-alkanolamine metallacycle compounds for electrically conductive layer formation

Supplementary files

Article information

Article type
Communication
Submitted
25 Nov 2015
Accepted
13 Jan 2016
First published
18 Jan 2016
This article is Open Access
Creative Commons BY license

RSC Adv., 2016,6, 12048-12052

Author version available

Low temperature sintering process of copper fine particles under nitrogen gas flow with Cu2+-alkanolamine metallacycle compounds for electrically conductive layer formation

T. Yonezawa, H. Tsukamoto, Y. Yong, M. T. Nguyen and M. Matsubara, RSC Adv., 2016, 6, 12048 DOI: 10.1039/C5RA25058G

This article is licensed under a Creative Commons Attribution 3.0 Unported Licence. You can use material from this article in other publications without requesting further permissions from the RSC, provided that the correct acknowledgement is given.

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