Effect of annealing on carrier transport properties of GaN-incorporated silicon

Abstract

GaN nanocrystals were formed in a silicon matrix by sequential implantation of Ga⁺ and N₂⁺ ions followed by either Furnace Annealing (FA) or Rapid Thermal Annealing (RTA). The formation of Ga-rich clusters and Ga–N bonds was confirmed by X-ray photoelectron and photoluminescence spectroscopy. A Schottky top contact and ohmic bottom contact were fabricated and current–voltage (I–V) characteristics of the implanted samples were studied. Current values were found to be higher in RTA samples and lower in FA samples. It is observed that the height of the Schottky barrier strongly depends on the kind of annealing and is found to be 0.65 ± 0.02 eV for FA and 0.56 ± 0.02 eV for RTA compared to the value of 0.61 ± 0.02 eV for the pristine Si sample. A carrier transport mechanism is discussed based on experimental results for both kinds of annealing.