Issue 16, 2017, Issue in Progress

Current-induced morphological evolution and reliability of Ag interconnects fabricated by a printing method based on nanoparticles

Abstract

Ag interconnects fabricated by a printing method were tested under accelerated temperature and current stressing to investigate their electrical reliability and morphological evolution. Under an accelerated current stressing condition, Ag metal atoms migrated in the direction of the electron wind force, resulting in simultaneous particle growth and increased resistance. The origin of the morphological change and resistance increase was considered to be the Joule heating at the necks between particles due to the current crowding effect. Joule heating at the necks of the connected particles accelerated the electromigration (EM) phenomenon, which generated abnormal particle growth in the Ag interconnects, which eventually resulted in failure during the reliability tests. The experimental results for Ag interconnects annealed under different conditions provide further evidence of the relation between electrical reliability and morphological change.

Graphical abstract: Current-induced morphological evolution and reliability of Ag interconnects fabricated by a printing method based on nanoparticles

Supplementary files

Article information

Article type
Communication
Submitted
24 Nov 2016
Accepted
17 Jan 2017
First published
01 Feb 2017
This article is Open Access
Creative Commons BY license

RSC Adv., 2017,7, 9719-9723

Current-induced morphological evolution and reliability of Ag interconnects fabricated by a printing method based on nanoparticles

K. Jang, J. Hwang, Y. Park, J. Lee, N. Kim, J. Yu and Y. Joo, RSC Adv., 2017, 7, 9719 DOI: 10.1039/C6RA27259B

This article is licensed under a Creative Commons Attribution 3.0 Unported Licence. You can use material from this article in other publications without requesting further permissions from the RSC, provided that the correct acknowledgement is given.

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