Bottom-up nanoarchitectures of semiconductor nano-building blocks obtained via a controllable in situ SEM-FIB thermal soldering method

Abstract

Here we demonstrate that the building blocks of semiconductor WO₃ nanowires can be controllably soldered together via a novel nano-soldering technique of in situ SEM-FIB thermal soldering, in which the soldering temperature can be precisely retained in an optimal range to avoid strong thermal diffusion.