Effect of glyphosate on X-ray diffraction of copper films prepared by electrochemical deposition

Abstract

In the process of electrochemical deposition of metals, the additives can directly affect the final morphology of the metal. Using glyphosate as the additive, copper thin films were prepared by the electrochemical deposition method from a CuSO₄ aqueous solution under a specific voltage. The copper thin films were grown on the surface of the indium tin oxide (ITO) film, which was used as the working electrode in a classical three-electrode cell. Glyphosate combined with the copper ion to form a complex, and hindered further reduction and crystallization of the copper ions. The results indicated that the peak intensities of the X-ray diffraction peaks decreased with the increase in the glyphosate concentrations, which can be used as a basis for quantitative detection. The method is simple and highly sensitive.