Issue 28, 2019
From the journal:

RSC Advances

A three-dimensional metal–organic framework for a guest-free ultra-low dielectric material†

W. Xu,‡b   S. S. Yu,‡a   H. Zhang‡a  and  H. B. Duan ORCID logo *ac  

* Corresponding authors

a School of Environmental Science, Nanjing Xiaozhuang University, Nanjing, 211171, P. R. China
E-mail: duanhaibao4660@163.com

b Department of Chemistry, Huangshan University, Huangshan 245041, P. R. China

c Department of Chemistry and Biochemistry, University of California, Los Angeles, California 90095-1569, USA

Abstract

A three-dimensional metal–organic framework compound [NH2(CH3)2]2[Zn3(bpdc)4]·3DMF (1) shows two step dielectric relaxation and its guest-free framework (1′) possesses an ultra-low κ value of 1.80 (at 100 kHz, it is the lowest value for MOFs reported to date) over a wide temperature range and high thermal stability.

Graphical abstract: A three-dimensional metal–organic framework for a guest-free ultra-low dielectric material

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Article information

DOI
https://doi.org/10.1039/C9RA03032H
Article type
Paper
Submitted
24 Apr 2019
Accepted
16 May 2019
First published
23 May 2019
This article is Open Access
Creative Commons BY-NC license

RSC Adv., 2019,9, 16183-16186

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A three-dimensional metal–organic framework for a guest-free ultra-low dielectric material

W. Xu, S. S. Yu, H. Zhang and H. B. Duan, RSC Adv., 2019, 9, 16183 DOI: 10.1039/C9RA03032H

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