Issue 36, 2019, Issue in Progress

Ag-NPs/MWCNT composite-modified silver-epoxy paste with improved thermal conductivity

Abstract

Heat dissipation is a critical issue in high-performance electronics, which needs to be solved, and an electronic paste is a good choice to solve this issue. In this paper, silver nanoparticles/multi-walled carbon nanotube (Ag-NPs/MWCNT) composites were prepared by the chemical process for the modification of electronic pastes. The micromorphology and spectral analysis of the as-prepared Ag-NPs/MWCNT composites indicated that Ag-NPs were uniformly distributed on the MWCNT surfaces with high distribution densities; the average size of Ag-NPs was estimated to be 8.29 nm. The as-obtained Ag-NPs/MWCNT composites were then added to a silver-epoxy paste. Field emission scanning electron microscopy (FESEM), thermogravimetry (TG) and thermal conductivity analyses suggested the incorporation of Ag-NPs/MWCNT composites in the silver-epoxy paste; Ag flakes were better connected by Ag-NPs/MWCNTs, which improved the thermal conductivity of the paste from 0.73 to 0.96 W m−1 K−1. However, more weight loss was observed when Ag-NPs/MWCNTs were incorporated in the silver-epoxy paste. Overall, the addition of Ag-NPs/MWCNTs into the silver-epoxy paste increased the thermal conductivity, which can be applied to high-performance electronics.

Graphical abstract: Ag-NPs/MWCNT composite-modified silver-epoxy paste with improved thermal conductivity

Article information

Article type
Paper
Submitted
25 Apr 2019
Accepted
17 Jun 2019
First published
02 Jul 2019
This article is Open Access
Creative Commons BY-NC license

RSC Adv., 2019,9, 20663-20669

Ag-NPs/MWCNT composite-modified silver-epoxy paste with improved thermal conductivity

Y. Li, G. Gan, Y. Huang, X. Yu, J. Cheng and C. Liu, RSC Adv., 2019, 9, 20663 DOI: 10.1039/C9RA03090E

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