Issue 44, 2019

High thermal conductivity property of polyamide-imide/boron nitride composite films by doping boron nitride quantum dots

Abstract

In this study, we report a flexible polyamide-imide (PAI)/boron nitride nanosheet (BNNS) composite film with improved thermal conductivity by doping boron nitride quantum dots (BNQDs) using an evaporation-induced self-assembly method. Continuous thermal conductive paths are constructed using BNQDs and BNNS in a PAI matrix, and the heat flow is effectively transmitted along the paths to improve the in-plane thermal conductivity (TC) of the PAI composite film. The synergistic effect between the BNNS and BNQDs plays a pivotal role in the formation of a continuous thermal conductive path. The PAI/BNNS/BNQD composite film shows an in-plane thermal conductivity of 7.69 W m−1 K−1 at a BNNS loading of 9 wt% and a BNQD loading of 1 wt%. This work provides valuable guidance for the design of thermal management materials to meet the efficient heat dissipation requirements of electronic devices.

Graphical abstract: High thermal conductivity property of polyamide-imide/boron nitride composite films by doping boron nitride quantum dots

Supplementary files

Article information

Article type
Paper
Submitted
09 Aug 2019
Accepted
03 Oct 2019
First published
07 Oct 2019

J. Mater. Chem. C, 2019,7, 13896-13903

High thermal conductivity property of polyamide-imide/boron nitride composite films by doping boron nitride quantum dots

S. Zhou, T. Xu, F. Jiang, N. Song, L. Shi and P. Ding, J. Mater. Chem. C, 2019, 7, 13896 DOI: 10.1039/C9TC04381K

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