Issue 9, 2020
From the journal:

Materials Advances

Strengthening epoxy adhesives at elevated temperatures based on dynamic disulfide bonds†

Hsing-Ying Tsai,ab   Yasuyuki Nakamura,a   Takehiro Fujitaa  and  Masanobu Naito ORCID logo *ab  

* Corresponding authors

a Data-driven Polymer Design Group, Research and Services Division of Materials Data and Integrated System (MaDIS), National Institute for Materials Science (NIMS), 1-2-1, Sengen, Tsukuba, Ibaraki 305-0047, Japan
E-mail: NAITO.Masanobu@nims.go.jp

b Program in Materials Science and Engineering, Graduate School of Pure and Applied Sciences, University of Tsukuba, 1-1-1, Tenodai, Tsukuba, Ibaraki 305-8571, Japan

Abstract

Epoxy resins incorporating aromatic disulfide bonds demonstrated improved adhesive properties with increasing temperature below their glass transition points. This behaviour was explained in terms of the relatively low topology freezing transition temperature of these materials as compared with their glass transition temperatures.

Graphical abstract: Strengthening epoxy adhesives at elevated temperatures based on dynamic disulfide bonds

About
Cited by
Related
Download options Please wait...

Supplementary files

Article information

DOI
https://doi.org/10.1039/D0MA00714E
Article type
Communication
Submitted
17 Sep 2020
Accepted
19 Nov 2020
First published
21 Nov 2020
This article is Open Access
Creative Commons BY-NC license

Mater. Adv., 2020,1, 3182-3188

Permissions

Request permissions

Strengthening epoxy adhesives at elevated temperatures based on dynamic disulfide bonds

H. Tsai, Y. Nakamura, T. Fujita and M. Naito, Mater. Adv., 2020, 1, 3182 DOI: 10.1039/D0MA00714E

This article is licensed under a Creative Commons Attribution-NonCommercial 3.0 Unported Licence. You can use material from this article in other publications, without requesting further permission from the RSC, provided that the correct acknowledgement is given and it is not used for commercial purposes.

To request permission to reproduce material from this article in a commercial publication, please go to the Copyright Clearance Center request page.

If you are an author contributing to an RSC publication, you do not need to request permission provided correct acknowledgement is given.

If you are the author of this article, you do not need to request permission to reproduce figures and diagrams provided correct acknowledgement is given. If you want to reproduce the whole article in a third-party commercial publication (excluding your thesis/dissertation for which permission is not required) please go to the Copyright Clearance Center request page.

Read more about how to correctly acknowledge RSC content.

Social activity

Spotlight

Advertisements