Issue 61, 2021, Issue in Progress

Preparation of boron nitride nanosheets via polyethyleneimine assisted sand milling: towards thermal conductivity and insulation applications

Abstract

Hexagonal boron nitride (h-BN) is often used as a filler in polymer composites due to its good thermal conductivity and insulation properties. However, the compatibility between h-BN and the matrix limits its application areas. To overcome this issue, a combination of mechanical liquid phase exfoliation and chemical interfacial modification was adopted in this work. Polyethyleneimine (PEI) was used as the exfoliation reagent to prepare PEI-functionalized h-BN nanosheets, denoted as PEI@BNNS. Thermoplastic polyurethane (TPU) composites with different contents of h-BN and PEI@BNNS which were recorded as h-BN/TPU and PEI@BNNS/TPU were successfully prepared through a hot-pressing process, respectively. The results show that PEI@BNNS/TPU composites have better in-plane thermal conductivity while maintaining insulation, and with the content of 5 wt% PEI@BNNS, the in-plane thermal conductivity of the PEI@BNNS/TPU composite is up to 0.61 W m−1 K−1, which is three times that of pure TPU (0.22 W m−1 K−1).

Graphical abstract: Preparation of boron nitride nanosheets via polyethyleneimine assisted sand milling: towards thermal conductivity and insulation applications

Supplementary files

Article information

Article type
Paper
Submitted
03 Aug 2021
Accepted
13 Nov 2021
First published
29 Nov 2021
This article is Open Access
Creative Commons BY license

RSC Adv., 2021,11, 38374-38382

Preparation of boron nitride nanosheets via polyethyleneimine assisted sand milling: towards thermal conductivity and insulation applications

B. Wang, H. Ji, X. Zhang and X. Qu, RSC Adv., 2021, 11, 38374 DOI: 10.1039/D1RA05878A

This article is licensed under a Creative Commons Attribution 3.0 Unported Licence. You can use material from this article in other publications without requesting further permissions from the RSC, provided that the correct acknowledgement is given.

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