Issue 17, 2022
From the journal:

Chemical Communications

Ultrathin covalent and cuprophilic interaction-assembled copper–sulfur monolayer in organic metal chalcogenide for oriented photoconductivity†

Guang-Ning Liu, ORCID logo *a   Rang-Dong Xu,a   Ming-Kun Li,a   Yiqiang Sun, ORCID logo a   Meng-Jie Zhou,a   Rui-Yun Cai,a   Zuo-Jiang You,a   Xiao-Ming Jiang ORCID logo b  and  Cuncheng Li ORCID logo a  

* Corresponding authors

a School of Chemistry and Chemical Engineering, University of Jinan, Jinan, Shandong 250022, P. R. China
E-mail: chm_liugn@ujn.edu.cn

b State Key Laboratory of Structural Chemistry, Fujian Institute of Research on the Structure of Matter, Chinese Academy of Sciences, Fuzhou, Fujian 350002, P. R. China

Abstract

We report the thinnest copper sulfur atomic monolayer in an organic copper chalcogenide [Cu(CMP)]n (CMP = 5-chloro-2-mercaptopyridine). The layer features a new type of copper sulfur structure woven by both covalent bond and cuprophilic interaction and shows an intriguing oriented photoconductivity.

Graphical abstract: Ultrathin covalent and cuprophilic interaction-assembled copper–sulfur monolayer in organic metal chalcogenide for oriented photoconductivity

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Article information

DOI
https://doi.org/10.1039/D2CC00145D
Article type
Communication
Submitted
09 Jan 2022
Accepted
25 Jan 2022
First published
25 Jan 2022

Chem. Commun., 2022,58, 2858-2861

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Ultrathin covalent and cuprophilic interaction-assembled copper–sulfur monolayer in organic metal chalcogenide for oriented photoconductivity

G. Liu, R. Xu, M. Li, Y. Sun, M. Zhou, R. Cai, Z. You, X. Jiang and C. Li, Chem. Commun., 2022, 58, 2858 DOI: 10.1039/D2CC00145D

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