Issue 33, 2022

Highly flexible cellulose nanofiber/single-crystal nanodiamond flake heat spreader films for heat dissipation

Abstract

Thermally conductive and electrically insulating polymer composites are ideal for applying in electrical or electronic fields as thermal management materials. Diamond nanomaterials have been used as an ideal thermal conductive filler due to their excellent intrinsic thermal conductivity. In this work, utilizing single-crystal nanodiamond (SCND) flakes as the thermally conductive filler, flexible cellulose nanofiber/single-crystal nanodiamond (CNF/SCND) flake composite films with high thermal conductivity were prepared by vacuum-assisted filtration. The strong hydrogen bonding interaction between CNF and SCND and the highly ordered stacking structure of SCND flake layers endowed the composite films with satisfactory flexibility and excellent heat dissipation performance. Compared with pure CNF film, a remarkable thermal conductivity enhancement of approximately 145.6 times and enhanced thermal conductivity (76.23 W m−1 K−1) was achieved in our CNF/SCND composite films. In addition, the enhanced thermal conductivity and excellent mechanical strength, accompanied with excellent flexibility, can be attributed to the CNF/SCND films with low and medium filling content of SCND. This demonstrates that the CNF/SCND composite films are a promising candidate as a heat spreader to rapidly cool LED lamps or electronic devices.

Graphical abstract: Highly flexible cellulose nanofiber/single-crystal nanodiamond flake heat spreader films for heat dissipation

Supplementary files

Article information

Article type
Paper
Submitted
04 May 2022
Accepted
27 Jul 2022
First published
28 Jul 2022

J. Mater. Chem. C, 2022,10, 12070-12079

Highly flexible cellulose nanofiber/single-crystal nanodiamond flake heat spreader films for heat dissipation

P. Gong, L. Li, G. Fu, S. Shu, M. Li, Y. Wang, Y. Qin, X. Kong, H. Chen, C. Jiao, X. Ruan, T. Cai, W. Dai, C. Yan, K. Nishimura, C. Lin, N. Jiang and J. Yu, J. Mater. Chem. C, 2022, 10, 12070 DOI: 10.1039/D2TC01830F

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