Issue 32, 2023

Influence of sapphire substrate with miscut angles on hexagonal boron nitride films grown by halide vapor phase epitaxy

Abstract

(002) hexagonal boron nitride (h-BN) micron films were epitaxially grown on c-plane sapphire substrates with miscut angles to m-plane (m-miscut angle) by high-temperature and low-pressure halide vapor phase epitaxy. Herein, the influence of sapphire substrate with m-miscut angles, ranging from 0.1° to 1°, on the morphology, crystal quality, and residual stress of BN micron films was thoroughly investigated. XRD result demonstrated that the as-grown BN films were predominantly [002]-oriented h-BN with t-BN phase. The growth rate of h-BN remained unchanged at about 62 nm min−1 regardless of the substrate miscut angle, while the h-BN (002) diffraction peak broadened and the E2g vibration mode of h-BN exhibited a blueshift as the miscut angle increases. With an m-miscut angle of 0.1°, the crystal quality of the BN film was most optimized and the content of h-BN reached 45.93% at the growth temperature of 1650 °C and V/III ratio of 6. The residual stress was also most released, in which the peak position and full width at the half maximum of E2g peak for h-BN were 1368 cm−1 and 34 cm−1, respectively. Under this condition, h-BN grows in a layered form and the nuclei coalesce into smooth micron-sized grains at the surface. The stoichiometric ratio between nitrogen and boron in the h-BN films is less than 1, possibly due to nitrogen deficiency caused by ammonia pulse growth mode.

Graphical abstract: Influence of sapphire substrate with miscut angles on hexagonal boron nitride films grown by halide vapor phase epitaxy

Article information

Article type
Paper
Submitted
24 May 2023
Accepted
17 Jul 2023
First published
02 Aug 2023

CrystEngComm, 2023,25, 4604-4610

Influence of sapphire substrate with miscut angles on hexagonal boron nitride films grown by halide vapor phase epitaxy

M. Chen, Q. Zhang, C. Fang, Z. Shen, Y. Lu, T. Liu, S. Tan and J. Zhang, CrystEngComm, 2023, 25, 4604 DOI: 10.1039/D3CE00528C

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