Issue 24, 2023

Maskless patterning of metal nanoparticles and silicon nanostructures by a droplet deposition and etching process

Abstract

This paper introduces a droplet-based method to deposit metal nanoparticles (named: droplet deposition) and etch silicon surfaces creating silicon nanostructures (named: droplet etching). The droplet deposition and etching process is a simple and cost-effective method that only requires a pipette tip for silver and gold nanoparticle coating and fabrication of silicon nanostructures. Besides, it also eliminates the need for mask designs or other fabrication facilities, simplifying the nanoparticle and silicon nanostructure patterning process. For the noble metal nanoparticle coating by droplet deposition, we investigate the influence of various process parameters such as metal ion concentration, hydrofluoric acid concentration, deposition time, and temperature effects on the resulting nanoparticle plating. And for silicon nanostructure creation, we use the droplet etching technique that selectively etches the silicon in regions where metal nanoparticles have been deposited while other regions remain unaffected and well-preserved. Finally, we demonstrate the capability of hand-writing geometric patterning, transferring pre-defined patterns by shadow masking and mass production for droplet deposition and etching using a multi-channel (8-channel) pipette.

Graphical abstract: Maskless patterning of metal nanoparticles and silicon nanostructures by a droplet deposition and etching process

Article information

Article type
Paper
Submitted
08 Jul 2023
Accepted
16 Nov 2023
First published
18 Nov 2023
This article is Open Access
Creative Commons BY-NC license

Mater. Adv., 2023,4, 6730-6740

Maskless patterning of metal nanoparticles and silicon nanostructures by a droplet deposition and etching process

C. Tsao and P. Shen, Mater. Adv., 2023, 4, 6730 DOI: 10.1039/D3MA00380A

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