Issue 12, 2023

Conductive and antibacterial dual-network hydrogel for soft bioelectronics

Abstract

Conductive hydrogels have shown significant potential for use in soft bioelectronics due to their unique similarities to biological tissue, including high water content, low modulus, and conductivity. However, their high water content makes them susceptible to absorbing microorganisms and promoting bacterial growth, which can trigger an immune response. Besides, the adhesion and biocompatibility of the hydrogel are not satisfactory, seriously limiting the conductive hydrogel's high-performance applications in human healthcare monitoring. Herein, the problem is addressed by introducing borax through a swelling and a semi-dehydration method into the interpenetrated network of a polyvinyl alcohol and poly(acrylic acid) hydrogel. The hydrogel exhibits both outstanding antibacterial (>99.99% toward E. coli and S. aureus) activity and high ionic conductivity, in addition to tissue-like softness, strong wet-tissue adhesion (600 J m−2 for skin), environmental stability, and excellent biocompatibility. Furthermore, the as-prepared hydrogel can serve as a biosensing conductor, showing high-quality recording and monitoring of real-time tiny yet complex muscle movements during speaking and realizing neuromodulation through low-current electronic stimulation (40 μA) of a rat's nerve. Simultaneously, the hydrogel also exhibits the capacity to accelerate wound healing. Therefore, the proposed antibacterial conductive hydrogel is a safer option for next-generation bioelectronic materials in human healthcare.

Graphical abstract: Conductive and antibacterial dual-network hydrogel for soft bioelectronics

Supplementary files

Article information

Article type
Communication
Submitted
16 Jun 2023
Accepted
25 Sep 2023
First published
11 Oct 2023

Mater. Horiz., 2023,10, 5805-5821

Conductive and antibacterial dual-network hydrogel for soft bioelectronics

H. Sun, S. Wang, F. Yang, M. Tan, L. Bai, P. Wang, Y. Feng, W. Liu, R. Wang and X. He, Mater. Horiz., 2023, 10, 5805 DOI: 10.1039/D3MH00813D

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