Issue 6, 2023

A multifunctional integrated carbon nanotubes/polyphenylene sulfide composite: preparation, properties and applications

Abstract

Although great progress has been achieved in polyphenylene sulfide (PPS) composites by the use of carbon nanotubes (CNTs), the development of cost-efficient, well dispersive and multifunctional integrated PPS composites has yet to be achieved because of the strong solvent resistance of PPS. In this work, a CNTs-PPS/PVA composite material has been prepared by mucus dispersion-annealing, which employed polyvinyl alcohol (PVA) to disperse PPS particles and CNTs at room temperature. Dispersion and scanning electron microscopy observations revealed that PVA mucus can uniformly suspend and disperse micron-sized PPS particles, promoting the interpenetration of the micro–nano scale between PPS and CNTs. During the annealing process, PPS particles deformed and then crosslinked with CNTs and PVA to form a CNTs-PPS/PVA composite. The as-prepared CNTs-PPS/PVA composite possesses outstanding versatility, including excellent heat stability with resistant temperatures up to 350 °C, corrosion resistance against strong acids and alkalis for up to 30 days, and distinguished electrical conductivity with 2941 S m−1. Besides, a well-dispersed CNTs-PPS/PVA suspension could be used to 3D print microcircuits. Hence, such multifunctional integrated composites will be highly promising in the future of new materials. This research also develops a simple and meaningful method to construct composites for solvent resistant polymers.

Graphical abstract: A multifunctional integrated carbon nanotubes/polyphenylene sulfide composite: preparation, properties and applications

Supplementary files

Article information

Article type
Paper
Submitted
26 Nov 2022
Accepted
12 Feb 2023
First published
15 Feb 2023
This article is Open Access
Creative Commons BY-NC license

Nanoscale Adv., 2023,5, 1740-1749

A multifunctional integrated carbon nanotubes/polyphenylene sulfide composite: preparation, properties and applications

L. Jia, J. Hao, Q. Feng, H. Li and K. Liu, Nanoscale Adv., 2023, 5, 1740 DOI: 10.1039/D2NA00855F

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