Super tough and high adhesive eutectic ionogels enabled by high-density hydrogen bond network

Abstract

Ionogels have attracted tremendous interest for flexible electronics due to their excellent deformability, conductivity, and environmental stability. However, most ionogels suffer from low strength and poor toughness, which limit their practical applications. This article presents a strategy for fabricating ionogels with high toughness by constructing high-density hydrogen bonds within their microstructure. The ionogels exhibit a maximum fracture strength of 11.44 MPa, and can sustain a fracture strain of 506%. They also demonstrate a fracture energy of 27.29 MJ m⁻³ and offer a wide range of mechanical property adjustments (fracture stress from 0.3 to 11.44 MPa, fracture strain from 506% to 1050%). Strain sensors assembled with ionogels demonstrate exceptional sensing performance and enable motion detection of human joints. This study provides a new approach for achieving strong and tough ionogel design used for high-performance flexible electronic applications.