Issue 18, 2024

Stepped copper sites coupling voltage-induced surfactant assembly to achieve efficient CO2 electroreduction to formate

Abstract

The electrochemical reduction of carbon dioxide (CO2) into formate holds great promise. However, the ongoing competition of parallel reactions, including the generation of hydrogen (H2), carbon monoxide (CO), and multi-carbon products, continues to be a significant factor influencing the formate selectivity. Here, we report a copper-based heterojunction (Cu2O@Cu) precatalyst, which undergoes significant structural reconstruction, resulting in the formation of stepped Cu sites on a hierarchical dendritic array. The formate selectivity of reconstructed Cu2O@Cu can achieve up to 95.9% at a low potential of āˆ’0.6 V versus the reversible hydrogen electrode when quaternary ammonium cationic surfactants are introduced. Meticulous in situ spectroscopic and theoretical analyses reveal that the electrically driven alignment of surfactants not only repels hydrated ions, thereby inhibiting proton delivery in H2 evolution, but also interacts with stepped Cu sites to deactivate CO and Cā€“C coupling pathways. The electrified modulation of interfacial microenvironment ultimately suppresses the evolution of H2, CO, and multi-carbon products, ensuring the high-selectivity conversion of CO2 to formate. This study highlights the crucial synergistic effect of structural reconstruction and ligand modification in enhancing electrocatalysis.

Graphical abstract: Stepped copper sites coupling voltage-induced surfactant assembly to achieve efficient CO2 electroreduction to formate

Supplementary files

Article information

Article type
Paper
Submitted
20 Jun 2024
Accepted
13 Aug 2024
First published
14 Aug 2024

Energy Environ. Sci., 2024,17, 6779-6786

Stepped copper sites coupling voltage-induced surfactant assembly to achieve efficient CO2 electroreduction to formate

S. Qiao, G. Zhang, D. Tian, W. Xu, W. Jiang, Y. Cao, J. Qian, J. Zhang, Q. He and L. Song, Energy Environ. Sci., 2024, 17, 6779 DOI: 10.1039/D4EE02697G

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