Issue 2, 2024

High-temperature ternary Cu–Si–Al alloy as a core–shell microencapsulated phase change material: fabrication via dry synthesis method and its thermal stability mechanism

Abstract

In the quest for efficient high-temperature thermal energy storage systems (TES) and power-to-heat-to-power systems (PHP), this study focuses on the development of Cu–12.8Si–20Al/Al2O3 core–shell microencapsulated phase change materials (MEPCMs). The Cu–12.8Si–20Al alloy, with melting point range of 738–758 °C was selected as the core PCM. Two subsequent physical methods were performed to optimize the MEPCMs: (1) uniformly coating the core with shell nanoparticles via a dry synthesis mechanical impact technique; (2) conducting heat oxidation in an O2 atmosphere to foster a robust shell structure. To ascertain the optimal structure for the MEPCM, we investigated three shell variants: α-Al2O3, AlOOH, and a mixture of both. Significantly, the α-Al2O3 nanoparticles manifested a dual-layered shell, defined by an internally sintered α-Al2O3 nanoparticles layer and an overlying sub-nanoparticles layer. This construction enhanced the MEPCMs’ thermal resilience: allowing them to withstand over 600 cycles of endothermic and exothermic phases, as well as affirming their endurance under extensive 100 h air exposure at 900 °C. The synergy between α-Al2O3 and AlOOH in the mixed shell revealed a pivotal role of AlOOH, which served as an adept sintering agent to enhance the MEPCM's thermal stability. In conclusion, the Cu–Si–Al/Al2O3 MEPCM was successfully produced as a promising candidate in high-temperature latent heat storage applications.

Graphical abstract: High-temperature ternary Cu–Si–Al alloy as a core–shell microencapsulated phase change material: fabrication via dry synthesis method and its thermal stability mechanism

Supplementary files

Article information

Article type
Paper
Submitted
02 Oct 2023
Accepted
27 Nov 2023
First published
13 Dec 2023
This article is Open Access
Creative Commons BY license

Mater. Adv., 2024,5, 675-684

High-temperature ternary Cu–Si–Al alloy as a core–shell microencapsulated phase change material: fabrication via dry synthesis method and its thermal stability mechanism

M. Aoki, M. Jeem, Y. Shimizu, T. Kawaguchi, M. Kondo, T. Nakamura, C. Fushimi and T. Nomura, Mater. Adv., 2024, 5, 675 DOI: 10.1039/D3MA00788J

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