Issue 23, 2024

Engineering hierarchical interfaces in high-temperature polymer dielectrics for electrostatic supercapacitors

Abstract

Dielectric capacitors are pivotal elements in advanced pulsed power devices and high-voltage, high-capacity power electronic converters, crucial for efficient energy storage. However, a major challenge remains the significant reduction in energy density and charge–discharged efficiency of dielectric polymers under high temperatures, primarily due to heightened electrical conduction losses. This study introduces a universal approach of heterojunction interface engineering in polyethersulfone (PESU) composites, aimed at improving capacitive performance across a broad temperature range. The introduction of one-dimensional heterojunction BaTiO3@Al2O3 nanofibers with large aspect ratios could enhance both the dielectric constant (εr) and breakdown strength (Eb). Specifically, the creation of hierarchical interfaces increases the trap density and energy levels for mobile charges, effectively reducing conduction losses and improving Eb under high-temperature conditions. Consequently, the PESU-3 vol% BaTiO3@Al2O3 nanocomposite achieves an excellent energy density of 7.3 J cm−3 with over 90% retention at 150 °C and 550 MV m−1. Finite element simulations further confirm that the heterojunction structure of BaTiO3@Al2O3 nanofibers effectively inhibits the growth of breakdown paths. This work demonstrates that hierarchical interface engineering offers a powerful strategy to enhance capacitive performance in dielectric polymer composites under harsh conditions.

Graphical abstract: Engineering hierarchical interfaces in high-temperature polymer dielectrics for electrostatic supercapacitors

Supplementary files

Article information

Article type
Communication
Submitted
22 Aug 2024
Accepted
13 Sep 2024
First published
14 Sep 2024

Mater. Horiz., 2024,11, 6073-6081

Engineering hierarchical interfaces in high-temperature polymer dielectrics for electrostatic supercapacitors

X. Fan, Z. Li, Y. Zhang, P. Wang, J. Liu, J. Yu, J. Zhai, W. Li and Z. Pan, Mater. Horiz., 2024, 11, 6073 DOI: 10.1039/D4MH01123F

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