Issue 41, 2024

Influence of the TiN diffusion barrier on the leakage current and ferroelectricity in an Al-doped HfOx ferroelectric memristor and its application to neuromorphic computing

Abstract

The HfOx-based ferroelectric memristor is in the spotlight due to its complementary metal–oxide–semiconductor compatibility and scaling compared to existing perovskite-based ferroelectric memory. However, ferroelectric properties vary depending on the coefficient of thermal expansion of the top electrode, which is caused by strain engineering. When tungsten (W) with a small coefficient of thermal expansion is used as an electrode, the ferroelectric properties are improved, although the reliability is poor due to the diffusion of W atoms. Here, TiN can be used to prevent the diffusion of W. This metal nitride successfully suppresses the leakage current and induces a larger remanent polarization of 19.7 μC cm−2, a smaller coercive voltage of 9.26 V, and a faster switching speed. W/TiN/HAO/n+ Si can also exhibit multi-level characteristics and achieve a 10% read margin in 320 × 320 arrays. Ferroelectrics can also be applied to neuromorphic computing by imitating synaptic properties such as potentiation, depression, paired-pulse facilitation, and excitatory postsynaptic current. Using short-term plasticity, successful implementation in reservoir computing is also realized, achieving 95% classification accuracy. This paper shows promise for the use of memristors in artificial neural networks.

Graphical abstract: Influence of the TiN diffusion barrier on the leakage current and ferroelectricity in an Al-doped HfOx ferroelectric memristor and its application to neuromorphic computing

Supplementary files

Article information

Article type
Paper
Submitted
17 Jul 2024
Accepted
21 Sep 2024
First published
23 Sep 2024

Nanoscale, 2024,16, 19445-19452

Influence of the TiN diffusion barrier on the leakage current and ferroelectricity in an Al-doped HfOx ferroelectric memristor and its application to neuromorphic computing

E. Lim, E. Seo and S. Kim, Nanoscale, 2024, 16, 19445 DOI: 10.1039/D4NR02961E

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