A study on thermal behaviour of thermal barrier coating: investigation of particle size, YSZ/polysilazane, time and temperature curing effect

Abstract

Thermal conductivity and adhesion strength effects were studied for thermal barrier coatings (TBCs) with different particle sizes, YSZ content, time, and temperature curing. The study involves three stages. The first step focuses on the characteristics of YSZ/polysilazane as the TBC, which is characterized using Scanning Electron Microscopy (SEM), Fourier Transform Infrared (FTIR), X-Ray Diffraction (XRD), and Thermal Gravimetric Analysis (TGA). The second and third steps assess thermal conductivity and adhesion strength based on variables such as particle size, YSZ/polysilazane, time, and curing temperature. Results show that there was a synergistic effect between particle size-YSZ content and time–temperature curing to obtain specimens with good thermal properties. SB270/70 showed the lowest temperature compared to other specimens, up to 160 °C. Furthermore, YSZ/polysilazane thermal conductivity and adhesion properties could be enhanced by a prolonged curing time and higher temperature. This study emphasizes that the modification of particle size, YSZ content, time, and temperature curing is a promising strategy to improve the thermal properties of TBCs.