Issue 43, 2024

Advancing thermal management in electronics: a review of innovative heat sink designs and optimization techniques

Abstract

The ongoing trend towards miniaturizing electronic devices and increasing their power densities has created substantial challenges in managing the heat they produce. Traditional heat sink designs often fall short of meeting modern electronics' rigorous thermal management needs. As a result, researchers and engineers are turning to innovative heat sink designs and optimization methods to improve thermal performance. This review article offers an overview of the latest advancements in designing and optimising advanced heat sinks for electronic cooling. It explores various techniques to enhance heat transfer, including advanced surface geometries and microchannels. Additionally, the review covers computational fluid dynamics (CFD) modelling and experimental validation methods used to refine heat sink designs. Further insight into fouling and its prevention has been discussed. The insights provided in this article are intended to serve as a valuable resource for thermal engineers, and researchers focused on managing the heat in high-power electronic systems.

Graphical abstract: Advancing thermal management in electronics: a review of innovative heat sink designs and optimization techniques

Article information

Article type
Review Article
Submitted
12 Aug 2024
Accepted
20 Sep 2024
First published
16 Oct 2024
This article is Open Access
Creative Commons BY license

RSC Adv., 2024,14, 31291-31319

Advancing thermal management in electronics: a review of innovative heat sink designs and optimization techniques

M. A. Rahman, S. M. M. Hasnain, P. Paramasivam and A. G. Ayanie, RSC Adv., 2024, 14, 31291 DOI: 10.1039/D4RA05845C

This article is licensed under a Creative Commons Attribution 3.0 Unported Licence. You can use material from this article in other publications without requesting further permissions from the RSC, provided that the correct acknowledgement is given.

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