Remarkably boosted high-temperature energy storage of a polymer dielectric induced by polymethylsesquioxane microspheres

Abstract

Polymer dielectrics are the key materials in next-generation electrical power systems. However, they usually suffer from dramatic deterioration of capacitive performance at high temperatures. In this work, we demonstrate that polymethylsesquioxane (PMSQ) microspheres with a unique organic–inorganic hybrid structure can remarkably enhance the energy storage performance of a typical high-temperature dielectric polymer polyetherimide (PEI). Compared with traditional ceramic fillers, there exists –CH₃ on the surface of PMSQ microspheres, which results in good compatibility between PMSQ and PEI. In addition, the PMSQ microspheres with excellent insulating properties can effectively block the charge transport, yielding significantly enhanced breakdown and energy storage performance. Consequently, the PEI based composite film with 5 wt% PMSQ microspheres exhibits ultrahigh energy storage densities of 12.83 J cm⁻³ and 9.40 J cm⁻³ with an efficiency (η) above 90% at 150 °C and 200 °C, respectively, which are 10.5 and 50.5 times those of the pure PEI film. This work demonstrates that microspheres with an organic–inorganic hybrid structure are excellent candidates for enhancing the high-temperature performance of polymer dielectrics, and these PMSQ/PEI composite films have huge potential for application in high-temperature film capacitors.