Issue 1, 2025

Exploring semiconductor potential: novel boron-based Ti3AlC2 and Ti4AlN3 MAX phase composites with tunable band gaps

Abstract

This research focuses on synthesizing chemically and thermally stable novel in situ Ti4AlN3 and Ti3AlC2 MAX phase reinforced boron-based composites using hot pressed and inert sintering processes, enabling a sizeable and wider bandgap for semiconductor applications. The study found that the MAX phase is formed from 0.2% to 2.9% in fabricated samples with increasing sintering temperatures from 950 °C to 1325 °C. As the sintering temperature increases, the percentage of crystallinity in Ti4AlN3 MAX phase reinforced boron-based composites increases from 69.14% to 89.88%, while in Ti3AlC2 MAX phase reinforced boron-based composites, it increases from 71.02% to 77.86%. And the energy bandgap shows a declining trend from 2.33 eV to 1.78 eV for Ti4AlB2N sample composites and 2.60 eV to 2.40 for Ti4AlB2C sample composites. The UV-vis test for boron-based Ti4AlN3 and Ti3AlC2 MAX phase composites shows an absorbance rate ranging from 0.065 a.u. to 0.63 a.u. and 0.008 to 2.4 a.u. respectively with increasing sintering temperature. Tuning these bandgap variations for Ti4AlN3 and Ti3AlC2 MAX phase reinforced boron-based composites with sintering temperature allows for customization of the material's optical absorption and emission spectra, which is important for semiconductor properties and for electronic and optoelectronic devices.

Graphical abstract: Exploring semiconductor potential: novel boron-based Ti3AlC2 and Ti4AlN3 MAX phase composites with tunable band gaps

Supplementary files

Article information

Article type
Paper
Submitted
04 Sep 2024
Accepted
07 Nov 2024
First published
12 Nov 2024
This article is Open Access
Creative Commons BY license

Nanoscale Adv., 2025,7, 288-309

Exploring semiconductor potential: novel boron-based Ti3AlC2 and Ti4AlN3 MAX phase composites with tunable band gaps

Md. S. Alam, M. A. Chowdhury, Md. S. Islam, Md. M. Islam, Md. A. Sabur and Md. M. Rana, Nanoscale Adv., 2025, 7, 288 DOI: 10.1039/D4NA00738G

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