Issue 12, 2022

Flexoelectric enhanced film for an ultrahigh tunable piezoelectric-like effect

Abstract

Recent advancements in electromechanical coupling effects enable electromechanical materials in soft and stretchable formats, offering unique opportunities for biomimetic applications. However, high electromechanical performance and mechanical elasticity hardly coexist in soft materials. Flexoelectricity, an electromechanical coupling between strain gradient and electric polarization, possesses great potential of strain gradient engineering and material design in soft elastomeric materials. In this work, we report a flexoelectric enhanced elastomer-based film (FEEF) with both high electromechanical capability and stretchability. The integrated strategies with biaxial pre-stretch, crosslinking density of the elastomer along with nanoparticle size, particle filling ratio and electric field charging lead to an enhanced flexoelectricity by two orders of magnitude. Furthermore, this FEEF reveals an ultrahigh electromechanical performance by flexoelectric enhancement with its mechanical design. As a representative demonstration, an ultrahigh piezoelectric-like sensing array is fabricated for multifunctional sensing applications in strain, force and vibration, verifying an equivalent piezoelectric coefficient d33 value as high as 1.42 × 104 pC N−1, and an average d33 value of 4.23 × 103 pC N−1 at a large-scale deformation range. This proposed ultra-high piezoelectric-like effect with its approach is anticipated to provide a possibility for highly tunable piezoelectric-like effect by enhanced flexoelectricity and mechanical design in elastomeric materials.

Graphical abstract: Flexoelectric enhanced film for an ultrahigh tunable piezoelectric-like effect

Supplementary files

Article information

Article type
Communication
Submitted
01 Sep 2022
Accepted
09 Sep 2022
First published
14 Sep 2022

Mater. Horiz., 2022,9, 2976-2983

Flexoelectric enhanced film for an ultrahigh tunable piezoelectric-like effect

H. Ji, S. Zhang, K. Liu, T. Wu, S. Li, H. Shen and M. Xu, Mater. Horiz., 2022, 9, 2976 DOI: 10.1039/D2MH01089E

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