Direct photochemical formation of Cu patterns on surface modified polyimide resin

Shingo Ikeda; Kensuke Akamatsu; Hidemi Nawafune

doi:10.1039/B107386A

You do not have JavaScript enabled. Please enable JavaScript to access the full features of the site or access our non-JavaScript page.

Shingo Ikeda,^a Kensuke Akamatsu*^b and Hidemi Nawafune*^b

Author affiliations

* Corresponding authors

^a Graduate School of Science, Konan University, 8-9-1 Okamoto, Higashinada, Kobe, Japan

^b Faculty of Science and Engineering, High Technology Research Center, Konan University, 8-9-1 Okamoto, Higashinada, Kobe, Japan
E-mail: akamatsu@center.konan-u.ac.jp

Abstract

A novel method is presented for the direct metallization of Cu on to surface modified polyimide resin by photochemical reduction of copper(II) ions with the aid of pre-adsorbed colloidal TiO₂ as photocatalyst: for the first time copper circuit patterns are successfully fabricated simply by using a quartz-on-glass photomask without the requirement for a photoresist.

Download options Please wait...

Article information

DOI: https://doi.org/10.1039/B107386A
Article type: Communication
Submitted: 15 Aug 2001
Accepted: 18 Sep 2001
First published: 09 Oct 2001

Download Citation

J. Mater. Chem., 2001,11, 2919-2921

Permissions

Request permissions