Reliable fabrication method of transferable micron scale metal pattern for poly(dimethylsiloxane) metallization

Abstract

We have developed a reliable fabrication method of forming micron scale metal patterns on poly(dimethylsiloxane) (PDMS) using a pattern transfer process. A metal stack layer consisting of Au–Ti–Au layers, providing a weak but reliable adhesion, was deposited on a silicon wafer. The metal stack layer was then transferred to a PDMS substrate using serial and selective etching. We demonstrate that features as small as 2 µm were reliably transferred on to the PDMS substrate for use as interconnects and electrodes for biosensors and flexible electronics application.