Issue 22, 2012
From the journal:

Chemical Communications

A new procedure to seal the pores of mesoporous low-k films with precondensed organosilica oligomers†

Frederik Goethals,a   Mikhail R. Baklanov,b   Ivan Ciofi,b   Christophe Detavernier,c   Pascal Van Der Voorta  and  Isabel Van Driessche*a  

* Corresponding authors

a Department of Inorganic and Physical Chemistry, Ghent University, Krijgslaan 281, building S3, 9000 Ghent, Belgium
E-mail: isabel.vandriessche@ugent.be
Fax: +32 92644983
Tel: +32 92644433

b IMEC, Kapeldreef 75, 3001 Leuven, Belgium

c Department of Solid States Sciences, Ghent University, Krijgslaan 281, building S1, 9000 Ghent, Belgium

Abstract

A new strategy to seal mesoporous low-k thin films with a pore size of 3 nm has been developed. This is achieved by spin-coating of a self-assembled carbon-bridged organosilica layer followed by a grafting with hexamethyl disilazane.

Graphical abstract: A new procedure to seal the pores of mesoporous low-k films with precondensed organosilica oligomers

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Article information

DOI
https://doi.org/10.1039/C2CC18017K
Article type
Communication
Submitted
22 Dec 2011
Accepted
16 Jan 2012
First published
17 Jan 2012

Chem. Commun., 2012,48, 2797-2799

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A new procedure to seal the pores of mesoporous low-k films with precondensed organosilica oligomers

F. Goethals, M. R. Baklanov, I. Ciofi, C. Detavernier, P. Van Der Voort and I. Van Driessche, Chem. Commun., 2012, 48, 2797 DOI: 10.1039/C2CC18017K

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