Issue 20, 2015

An extremely thin and robust interconnecting layer providing 76% fill factor in a tandem polymer solar cell architecture

Abstract

We report a thin and robust interconnecting layer (ICL) for polymer tandem solar cells. This ICL shows low absorption, good electrical contacts, large work function contrast and robustness. Its use yields tandem cells with a very high fill factor of 76%, making this ICL a promising component of future highly efficient multijunction organic solar cells.

Graphical abstract: An extremely thin and robust interconnecting layer providing 76% fill factor in a tandem polymer solar cell architecture

Supplementary files

Article information

Article type
Communication
Submitted
26 Mar 2015
Accepted
14 Apr 2015
First published
17 Apr 2015

J. Mater. Chem. A, 2015,3, 10681-10686

An extremely thin and robust interconnecting layer providing 76% fill factor in a tandem polymer solar cell architecture

A. Martínez-Otero, Q. Liu, P. Mantilla-Perez, M. M. Bajo and J. Martorell, J. Mater. Chem. A, 2015, 3, 10681 DOI: 10.1039/C5TA02205C

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