Issue 6, 2016
From the journal:

Nanoscale

Three-dimensional superhydrophobic copper 7,7,8,8-tetracyanoquinodimethane biointerfaces with the capability of high adhesion of osteoblasts†

Jie Zhou,‡ab   Jun-Bing Fan,‡b   Qiong Nie*a  and  Shutao Wang*b  

* Corresponding authors

a Department of Orthodontics, School and Hospital of Stomatology, Peking University, Beijing 100081, China
E-mail: nieqiong@pkuss.bjmu.edu.cn

b Laboratory of Bio-inspired Smart Interface Science, CAS Center for Excellence in Nanoscience, Technical Institute of Physics and Chemistry, Chinese Academy of Sciences, Beijing 100190, China
E-mail: stwang@mail.ipc.ac.cn

Abstract

A three-dimensional superhydrophobic copper 7,7,8,8-tetracyanoquinodimethane (CuTCNQ) nanowire array with the capability of high adhesion of osteoblasts was demonstrated. The CuTCNQ nanowire array was constructed by using a combined vapor deposition technique. The superhydrophobic nanowire array exhibited very high adhesion of osteoblasts, indicating that the CuTCNQ nanowire array was a good biointerface.

Graphical abstract: Three-dimensional superhydrophobic copper 7,7,8,8-tetracyanoquinodimethane biointerfaces with the capability of high adhesion of osteoblasts

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Article information

DOI
https://doi.org/10.1039/C5NR08305B
Article type
Communication
Submitted
24 Nov 2015
Accepted
14 Jan 2016
First published
15 Jan 2016

Nanoscale, 2016,8, 3264-3267

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Three-dimensional superhydrophobic copper 7,7,8,8-tetracyanoquinodimethane biointerfaces with the capability of high adhesion of osteoblasts

J. Zhou, J. Fan, Q. Nie and S. Wang, Nanoscale, 2016, 8, 3264 DOI: 10.1039/C5NR08305B

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