Effective optimization of surface passivation on porous silicon carbide using atomic layer deposited Al2O3

Abstract

Porous silicon carbide (B–N co-doped SiC) produced by anodic oxidation showed strong photoluminescence (PL) at around 520 nm excited by a 375 nm laser. The porous SiC samples were passivated by atomic layer deposited (ALD) aluminum oxide (Al₂O₃) films, resulting in a significant enhancement of the PL intensity (up to 689%). The effect of thickness, annealing temperature, annealing duration and precursor purge time on the PL intensity of ALD Al₂O₃ films was investigated. In order to investigate the penetration depth and passivation effect in porous SiC, the samples were characterized by X-ray photoelectron spectroscopy (XPS) and time-resolved PL. The optimized passivation conditions (20 nm Al₂O₃ deposited at 160 °C with purge time of 20 s, followed by an annealing for 5 min at 350 °C) for porous SiC were achieved and the results indicate that surface passivation by ALD Al₂O₃ thin films is a very effective method to enhance the luminescence efficiency of porous SiC.