Issue 18, 2017

Metal–insulator–semiconductor field-effect transistors (MISFETs) using p-type SnS and nanometer-thick Al2S3 layers

Abstract

Novel and cost-effective metal–insulator semiconductor field-effect transistor (MISFET) devices were fabricated using non-toxic tin mono sulfide (SnS) as the active layer sandwiched between aluminium and silver contacts with an unintentionally grown aluminium sulfide (Al2S3) interface layer. MISFET devices exhibit a high turn-on voltage of 5.13 V and excellent rectifying diode characteristics. These devices also show a high rectification factor of 1383 at a bias voltage of 6 V and series resistance of 3.4 MΩ, along with a very low leakage current of ∼10−9 A@−10 V. The overall results reveal that it could be possible to fabricate cost-effective and non-toxic MISFET devices by using SnS as an active layer for various power-electronic applications.

Graphical abstract: Metal–insulator–semiconductor field-effect transistors (MISFETs) using p-type SnS and nanometer-thick Al2S3 layers

Supplementary files

Article information

Article type
Paper
Submitted
02 Jan 2017
Accepted
08 Feb 2017
First published
16 Feb 2017
This article is Open Access
Creative Commons BY license

RSC Adv., 2017,7, 11111-11117

Metal–insulator–semiconductor field-effect transistors (MISFETs) using p-type SnS and nanometer-thick Al2S3 layers

D. Mudusu, K. R. Nandanapalli, S. R. Dugasani, R. Karuppannan, G. Kothakota Ramakrishna Reddy, R. G. Erode Subramanian and S. H. Park, RSC Adv., 2017, 7, 11111 DOI: 10.1039/C7RA00041C

This article is licensed under a Creative Commons Attribution 3.0 Unported Licence. You can use material from this article in other publications without requesting further permissions from the RSC, provided that the correct acknowledgement is given.

Read more about how to correctly acknowledge RSC content.

Social activity

Spotlight

Advertisements