Use of decomposable polymer-coated submicron Cu particles with effective additive for production of highly conductive Cu films at low sintering temperature

Yingqiong Yong; Mai Thanh Nguyen; Tetsu Yonezawa; Takashi Asano; Masaki Matsubara; Hiroki Tsukamoto; Ying-Chih Liao; Tengfei Zhang; Shigehito Isobe; Yuki Nakagawa

doi:10.1039/C6TC04360G

Use of decomposable polymer-coated submicron Cu particles with effective additive for production of highly conductive Cu films at low sintering temperature†

Yingqiong Yong,^a Mai Thanh Nguyen,^a Tetsu Yonezawa,

*^a Takashi Asano,^ab Masaki Matsubara,^ac Hiroki Tsukamoto,^a Ying-Chih Liao,^ad Tengfei Zhang,^a Shigehito Isobe^a and Yuki Nakagawa^a

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* Corresponding authors

^a Division of Materials Science and Engineering, Faculty of Engineering, Hokkaido University, Kita 13 Nishi 8, Kita-ku, Sapporo, Hokkaido 060-8628, Japan
E-mail: tetsu@eng.hokudai.ac.jp

^b Criminal Investigation Laboratory, Tokyo Metropolitan Police Department, 2-2-1 Kasumigaseki, Chiyoda-ku, Tokyo, Japan

^c Department of Materials and Environment Engineering, National Institute of Technology, Sendai College, 48 Nodayama, Medeshima-Shiote, Natori-shi, Miyagi 981-1239, Japan

^d Department of Chemical Engineering, National Taiwan University, No. 1, Sec. 4, Roosevelt Rd., Taipei, Taiwan

Abstract

A method for producing Cu films with low resistivity, based on low temperature sintering, is demonstrated. The Cu inks for preparing conductive Cu films consisted of Cu particles that were coated with a decomposable polymer (poly(propylenecarbonate), PPC) as well as a self-reducible copper formate/1-amino-2-propanol (CuF–IPA) complex as an additive. The sintering temperature used in this study was as low as 100 °C. Following sintering at a temperature of 100 °C, the lowest reported resistivity (8.8 × 10⁻⁷ Ω m) was achieved through the use of Cu-based metal–organic decomposition (MOD) inks. This was due to the dual promotional effects of the aminolysis of PPC with IPA and the pyrolysis of the CuF–IPA complex.

Journal of Materials Chemistry C

Use of decomposable polymer-coated submicron Cu particles with effective additive for production of highly conductive Cu films at low sintering temperature†

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Use of decomposable polymer-coated submicron Cu particles with effective additive for production of highly conductive Cu films at low sintering temperature

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