Issue 18, 2018

Highly thermal-stable and transparent silver nanowire conductive films via magnetic assisted electrodeposition of Ni

Abstract

In this study, a magnetic assisted electrodeposition process was developed to fabricate a hybrid silver nanowire conductive film with excellent performance. In the two-step fabrication process, the primary conductive film was dip-coated with a low concentration of AgNW ink, which gives decent conductivity and extraordinary transmittance. It is worth noting that the highly diluted ink solution is superior to a high concentration of silver nanowire ink, which is prone to aggregate and hard to redisperse. Next, a magnetic assisted electrodeposition process was applied to in situ grow a secondary metallic layer onto AgNWs, leading to a much better conductivity while maintaining the high transmittance, which well reconciles the contradictive requirements between transmittance and conductivity. Especially, thanks to the magnetic tuning effect, a unique Ni protective layer was formed to achieve prominent adhesion on the substrate without embedding the structure into any material. The conductivity of the Ni/AgNW-based TCFs has no obvious change even after heating at 400 °C for 30 min, which is by far the best thermal stability ever reported. In addition, the excellent electrical and optical performances (a typical sheet resistance of ca. 9.8 Ω sq−1 at a transmittance of ca. 95.3%) outperformed most of the existing AgNW-based TCFs. Two devices, including an HITSZ pattern of LED lights and a nanoheater, were fabricated to demonstrate the feasibility and the outstanding performance.

Graphical abstract: Highly thermal-stable and transparent silver nanowire conductive films via magnetic assisted electrodeposition of Ni

Supplementary files

Article information

Article type
Paper
Submitted
22 Feb 2018
Accepted
22 Mar 2018
First published
23 Mar 2018

J. Mater. Chem. C, 2018,6, 4887-4894

Highly thermal-stable and transparent silver nanowire conductive films via magnetic assisted electrodeposition of Ni

L. Zhang, Y. Ji, Y. Qiu, C. Xu, Z. Liu and Q. Guo, J. Mater. Chem. C, 2018, 6, 4887 DOI: 10.1039/C8TC00900G

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