Issue 2, 2020

The surface hybridization of diamond with vertical graphene: a new route to diamond electronics

Abstract

Herein a method is proposed for engineering the electronic properties (including the band structure) of diamond via surface hybridization with graphene. Graphene layers (5–50 nm in thickness) were grown vertically onto a polished 〈110〉 textured polycrystalline diamond plate (1 × 1 cm2) (vGr-diamond) at ∼1300 °C via hydrogen plasma etching in a chemical vapor deposition (CVD) chamber. Due to the crystallographic relationship, the graphene layers embed at an angle of 30° to the diamond surface comprising the (110) planes. The epitaxial relationship is demonstrated via low angle X-ray diffraction (XRD), the XRD rocking curve, Raman and scanning electron microscopy. With hybridization, the diamond sample reveals a strong photoluminescent (PL) signal at ∼2.78 eV (∼450 nm). The peak was assigned to the ‘interface defects’ of the vGr-diamond hybrid structure, which are a type of ‘surface defect’ of the CVD diamond that generates a peak at ∼2.69 eV. The blue shift (∼90 meV) of the interface defects is due to the compressive strain of ∼3% applied to the interface atoms. Simulations indicate that the hybrid structures possess a finite band gap of 1.85–0.25 eV, which decreases upon increasing the thickness of the graphene layers to ∼1.4 nm. The appearance of a small band gap was attributed to the compressive strain. These findings may provide a route for diamond to become a platform for next generation and extreme electronic devices.

Graphical abstract: The surface hybridization of diamond with vertical graphene: a new route to diamond electronics

Supplementary files

Article information

Article type
Communication
Submitted
07 Oct 2019
Accepted
28 Oct 2019
First published
14 Nov 2019
This article is Open Access
Creative Commons BY-NC license

Mater. Horiz., 2020,7, 470-476

The surface hybridization of diamond with vertical graphene: a new route to diamond electronics

K. P. S. S. Hembram, S. Lee, H. Im, H. Ju, S. Jeong and J. Lee, Mater. Horiz., 2020, 7, 470 DOI: 10.1039/C9MH01588D

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