Issue 21, 2021

One-step preparation of Cr2O3-based inks with long-term dispersion stability for inkjet applications

Abstract

Inkjet printing of functional materials has shown a wide range of applications in advertising, OLED display, printed electronics and other specialized utilities that require high-precision, mask-free, direct-writing deposition techniques. Nevertheless, the sedimentation risk of the refractory functional materials dispensed in inks hinders their further implementation. Herein, we present a bottom-up ink preparation strategy based on Cr2O3 by a one-step solvothermal method. The obtained ink remained stable under an equivalent natural sediment test for 2.5 years. The chemical composition of the solvothermal product was characterized, and the mechanism of the superior dispersion stability of Cr2O3 particles was analysed. These amorphous Cr2O3 particles were capped by ligands generated via low-temperature solvothermal reactions. Ethanol and acetylacetone covering the particle surfaces play an essential role in enhancing the solubility of Cr2O3 particles in the solvent forming the ultrastable colloidal ink. Moreover, this ink was successfully printed using a direct-write inkjet system JetLab®II on nylon fabrics, and the printed area of the fabrics shows a spectral correlation coefficient of 0.9043 to green leaves. Finally, we believe that the one-step bottom-up fabrication method of Cr2O3-based pigment inks may provide a general approach for preparing metal oxide-based pigment inks with long-term dispersion stability.

Graphical abstract: One-step preparation of Cr2O3-based inks with long-term dispersion stability for inkjet applications

Supplementary files

Article information

Article type
Paper
Submitted
31 Mar 2021
Accepted
28 Jul 2021
First published
28 Jul 2021
This article is Open Access
Creative Commons BY-NC license

Nanoscale Adv., 2021,3, 6048-6055

One-step preparation of Cr2O3-based inks with long-term dispersion stability for inkjet applications

D. Xie, Q. Luo, S. Zhou, M. Zu and H. Cheng, Nanoscale Adv., 2021, 3, 6048 DOI: 10.1039/D1NA00244A

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