Issue 29, 2021, Issue in Progress

Controllable fabrication and self-assembly of Cu nanostructures: the role of Cu2+ complexes

Abstract

The controllable fabrication of low dimensional nanostructures and the assembly of nanostructures into hierarchical higher order structures at the atomic or molecular level have been two hot-spots of current nano research. In this work, the fabrication and self-assembly of Cu nanostructures were carried out by reducing Cu2+ complexes in a mixed aqueous solution of NaOH and hydrazine hydrate at a water bath temperature of 60 °C. The reduction products were characterized using a metalloscope, a scanning electron microscope, a transmission electron microscope and a powder X-ray diffractometer. It was found that the fabrication and self-assembly of Cu nanostructures can be easily realized by controlling the types of Cu2+ complexes such as [Cu(OH)4]2−, [Cu(EDA)2]2+ and [Cu(EDA)(OH)2]. The authors further analyzed the important roles of Cu2+ complexes in the fabrication and self-assembly of Cu nanostructures. It was concluded that the Cu2+ complexes in the aqueous solution would spontaneously arrange into a certain soft template according to the principle of “like dissolves like” and the action of electrostatic forces of positive and negative charges. The as-formed templates determine the fabrication and self-assembly routes and the final products of the Cu nanostructures. Therefore, it provides a controllable and universal method for both fabrication and self-assembly of Cu nanostructures, which may have potential applications in the fields of electronic and optoelectronic nanodevices in the future.

Graphical abstract: Controllable fabrication and self-assembly of Cu nanostructures: the role of Cu2+ complexes

Article information

Article type
Paper
Submitted
26 Mar 2021
Accepted
10 May 2021
First published
14 May 2021
This article is Open Access
Creative Commons BY-NC license

RSC Adv., 2021,11, 17715-17720

Controllable fabrication and self-assembly of Cu nanostructures: the role of Cu2+ complexes

L. Yang and J. Su, RSC Adv., 2021, 11, 17715 DOI: 10.1039/D1RA02408F

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