Simulation of the peel of hydrogels with stiff backing

Abstract

In this work, the peel of hydrogels under a stiff backing constraint was studied using a finite element method. The finite element method was first validated by comparing the simulation results to theoretical predictions and experimental measurements. Then, the method was used to investigate the effects of adhesion thickness, adhesion length and backing thickness on the peel behaviors, as well as the stress distribution within the adhesion layer. The results indicated that the peel force–displacement curve has a constant profile when the adhesion thickness and backing thickness are prescribed so long as the adhesion length is sufficiently long. The peak peel force increases with the adhesion length and then plateaus. The larger the intrinsic peak stress or the thicker the backing, the higher the plateau. The steady-state peel force is independent of the backing thickness, while positively correlated with the strain energy storage of the hydrogel adhesion layer. The critical vertical displacement corresponding to the peak peel force increases with the hydrogel thickness and decreases with the backing thickness. However, the critical vertical displacement corresponding to the steady-state peel force increases with the backing thickness. The present work puts forward an effective numerical approach to probe the peel of hydrogels, which is beneficial for the design of relevant structures.