Issue 3, 2022

Ultrahigh charge–discharge efficiency and high energy density of a high-temperature stable sandwich-structured polymer

Abstract

A new generation of high-temperature dielectric materials toward capacitive energy storage is highly demanded, as power electronics are always exposed to elevated temperatures in high-power applications. Polymer dielectric materials, as ideal candidates for capacitors, suffer from deteriorated energy density because of their depressed dielectric constant and decreased breakdown strength at high temperatures, which become major barriers for their application in harsh environments. Here, sandwich-structured dielectric polymer nanocomposites with superior high-temperature capacitive performances are reported. Very different from the conventional single-layer designs, such sandwich-structured configurations can integrate the complementary properties of multiple spatially organized components in a synergistic manner, simultaneously raising the dielectric constant and breakdown strength, and subsequently greatly increasing the discharged energy density at elevated temperatures. Further analysis by simulation shows the evolution process of electrical tree channels in the experimental breakdown and dissipation of Joule heating. Consequently, the sandwich-structured polymer nanocomposites deliver an outstanding Ud value of 4.14 J cm−3, with a η value of above 90% at 150 °C, outperforming the current high-temperature dielectric polymers and composites. This work provides a new design paradigm for high-temperature electrical energy storage applications.

Graphical abstract: Ultrahigh charge–discharge efficiency and high energy density of a high-temperature stable sandwich-structured polymer

Supplementary files

Article information

Article type
Paper
Submitted
14 Oct 2021
Accepted
05 Dec 2021
First published
06 Dec 2021

J. Mater. Chem. A, 2022,10, 1579-1587

Ultrahigh charge–discharge efficiency and high energy density of a high-temperature stable sandwich-structured polymer

H. Chen, Z. Pan, Y. Cheng, X. Ding, J. Liu, Q. Chi, M. Yang, J. Yu and Z. Dang, J. Mater. Chem. A, 2022, 10, 1579 DOI: 10.1039/D1TA08855F

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