Issue 41, 2022

In situ fabrication of MXene/CuS hybrids with interfacial covalent bonding via Lewis acidic etching route for efficient sodium storage

Abstract

Recently, CuS has attracted intensive attention as an anode for sodium-ion batteries (SIBs) because of decent theoretical capacity based on the conversion reaction mechanism. Nevertheless, rapid capacity degradation and inferior rate performance significantly deteriorate its further application. Herein, an in situ growth strategy has been proposed to integrate CuS with highly conductive Ti3C2Tx MXene (Tx = –O and –Cl) through Lewis acidic molten salt etching followed by the vulcanization treatment. By virtue of the boosted Na+ diffusion and electronic transport kinetics, superior mechanical strain relief channel and robust interfacial covalent bonding, the as-prepared Ti3C2Tx/CuS anode exhibits improved cyclic performance (347.0 mA h g−1 after 800 cycles at 3 A g−1) and excellent rate capability (346.3 mA h g−1 at 8 A g−1). Furthermore, the assembled full cell by pairing the Ti3C2Tx/CuS anode with the Na3V2(PO4)3 cathode demonstrates excellent cyclability up to 800 cycles. More importantly, the density functional theory calculations further reveal the origin of the promoted electrochemical performance of the Ti3C2Tx/CuS composites. The presented strategy realizes the rational application of the Lewis acidic etching products and opens up a new door for the preparation of MXene/transition metal compounds hybrids as advanced SIB anodes.

Graphical abstract: In situ fabrication of MXene/CuS hybrids with interfacial covalent bonding via Lewis acidic etching route for efficient sodium storage

Supplementary files

Article information

Article type
Paper
Submitted
23 Aug 2022
Accepted
22 Sep 2022
First published
23 Sep 2022

J. Mater. Chem. A, 2022,10, 22135-22144

In situ fabrication of MXene/CuS hybrids with interfacial covalent bonding via Lewis acidic etching route for efficient sodium storage

P. Huang, H. Ying, S. Zhang, Z. Zhang and W. Han, J. Mater. Chem. A, 2022, 10, 22135 DOI: 10.1039/D2TA06695E

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