Issue 38, 2022

An ultralight and thermally conductive Ti3C2Tx MXene–silver nanowire cellular composite film for high-performance electromagnetic interference shielding

Abstract

Lightweight high-performance electromagnetic interference (EMI) shielding materials with excellent thermal conductivity and outstanding EMI shielding performances are highly satisfactory for modern integrated electronic and telecommunication systems in the fields of military, aerospace, smart and wearable electronics, and artificial intelligence. Herein, we prepared a cellular MXene@silver nanowire (Ag NW) composite film by a simple vacuum-assisted filtration process induced by potassium ions and freeze-drying after rapid pre-freezing with liquid nitrogen. The construction of the cellular structure can effectively improve the shielding effectiveness. Upon introducing the Ag NWs in the system, the interconnection networks were constructed for the MXene@Ag NW composite film, which significantly improved the electrical and thermal conductivity, further enhancing EMI shielding performance. The composite film with 80 wt% Ag NWs can deliver a high conductivity of 1245 S cm−1, ultrahigh EMI shielding efficiency (SE) of 81.11 dB in the X-band, and a high thermal conductivity of 26.19 W m−1 K−1. The prepared MXene@Ag NW cellular composite film has the advantages of high shielding efficiency and good thermal conductivity, which has important application value in manufacturing lightweight, high shielding efficiency materials and avoiding heat accumulation of electronic devices.

Graphical abstract: An ultralight and thermally conductive Ti3C2Tx MXene–silver nanowire cellular composite film for high-performance electromagnetic interference shielding

Supplementary files

Article information

Article type
Paper
Submitted
07 Jul 2022
Accepted
23 Aug 2022
First published
07 Sep 2022

J. Mater. Chem. C, 2022,10, 14169-14179

An ultralight and thermally conductive Ti3C2Tx MXene–silver nanowire cellular composite film for high-performance electromagnetic interference shielding

Z. Ma, H. Feng, Y. Feng, X. Ding, X. Wang, W. Wang, X. Zhang, S. Kong, X. Lan and Q. Li, J. Mater. Chem. C, 2022, 10, 14169 DOI: 10.1039/D2TC02856E

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